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     :: FINEPLACER® coreplus
 
 

Highlights

  » Components from 0.125 mm x 0,125 mm to 90 mm x 90 mm
  » JEDEC/IPC conform thermal management with top and bottom heating systems
  » Automated pick-up and touch-down with force measuring
  » Automated processes
  » Process traceability with SmartIdent
  » Perfect Solution to Observe an Unmodified Signal.
  » Intuitive user experience with SmartControl
  » Compact machine design
   
  Applications
  » Soldering of:
  » BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
  » Small passives down to 01005
  » RF shields, RF frames
  » Connectors, sockets
  » Sub assemblies, daughter boards
  » Pin in Paste (PiP)
  » Trough Hole Reflow (THR)
  » Reworkable underfill, conformal coating
     
  Processes
  » Component removal / De-soldering
  » Site cleaning
  » Re-balling
  » Paste printing (component, PCB)
  » Paste dipping
  » Fluxing
  » Soldering
     
     
 
 
 
   
 
 
 
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