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     :: FINEPLACER® coreplus
 
 
The FINEPLACERR coreplus is an all- round hot air rework station for electronic components and assemblies. The complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing, can be performed on the same compact rework system. The spectrum of compatible surface- mount devices ranges from very small (01005) to large components (BGA).The full- area Bottom Heating Module has been optimized for reworking medium sized PCB of consumer electronics (tablets, laptops, gaming consoles) or medical technology products (i.e. MRT devices). A pre- installed profile library and an intuitive visual user experience enables new operators to pick up work immediately. Numerous professional features, such as digital top heater calibration, precision touchdown force control and live process observation, make the FINEPLACERR coreplus a future- proof investment when the demands get tougher.
 

Highlights

  » Components from 0.125 mm x 0,125 mm to 90 mm x 90 mm
  » JEDEC/IPC conform thermal management with top and bottom heating systems
  » Automated pick-up and touch-down with force measuring
  » Automated processes
  » Process traceability with SmartIdent
  » Intuitive user experience with SmartControl
  » Compact machine design
   
  Features
  » Hot gas rework station
  » Automated soldering processes
  » Compact and robust design
  » Vision alignment system with fixed beam splitter
  » Intelligent thermal management
  » Real time process observation camera
  » Digital top heater calibration
  » Manual precision Z- travel range of the reflow arm
  Benefits
  » Even and reproducible heat distribution
  » User independent process operation
  » The whole rework cycle within one cost- effective system solution
  » Reproducible placement accuracy
  » Coordinated control of all process parameters: temperature, flow, time, process environment
  » Immediate visual feedback reduces process development time
  » Quick machine setup time
  » Safe handling of sensitive components
  Processes
  » Component removal / De-soldering
  » Site cleaning
  » Re-balling
  » Paste printing (component, PCB)
  » Paste dipping
  » Dispensing
  » Fluxing
  » Soldering
     
  Applications
  » Soldering of:
  • BGA, BGA/ CSP, QFN, DFN, PoP, QFP, PGA,
  • SON
  • Small passives down to 01005
  • RF shields, RF frames
  • Connectors, sockets
  • Sub assemblies, daughter boards
  » Pin in Paste (PiP)
  » Trough Hole Reflow (THR)
  » Reworkable underfill, conformal coating
 
 
 
   
 
 
 
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