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     :: FINEPLACER® micro rs
 
 
The FINEPLACERR micro rs is an enhanced hot air rework station for assembly and rework of all standard types of SMD components. A high level of process modularity allows all rework process steps within one system. The system is at home in production environments, R&D, process development and prototyping. The FINEPLACERR micro rs covers ultra small to large SMD components on small to large sized PCBs, with the goal to have highly reproducible soldering results.
 

Highlights*

  » Industry-leading thermal management
  » Components from 0.125 mm x 0.125 mm to 90 mm x 90 mm
  » Board sizes up to 460 mm x 310 mm
  » High efficiency board heater
  » Closed loop force control
  » Automated top heater calibration
  » Placement accuracy better than 10 µm
   
 

Features

  » Automated soldering processes
  » Overlay vision alignment system (VAS) with fixed beam splitter
  » Modular design
  » Integrated Process Management (IPM)
  » Real time process observation camera
  » Adaptive process library
  » Process transfer from system to system
  Benefits
  » Hands-off component placement, user independent process operation*
  » Outstanding placement accuracy and instant operation without adjustments
  » Provides high level of application flexibility
  » Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
  » Immediate visual feedback reduces process development time
  » Fast and easy process development
  » Identical results on different machines allow central profile development, administration and distribution
     
  Processes
  » Component removal / De- soldering
  » Site cleaning
  » Re- balling
  » Paste printing (component, PCB)
  » Paste dipping
  » Dispensing
  » Dispensing
    Soldering
     
  Applications
  » Soldering of:
  • BGA, BGA/ CSP, QFN, DFN, PoP, QFP, PGA,
  • SON
  • Small passives down to 0201
  • RF shields, RF frames
  • Connectors, sockets
  • Sub assemblies, daughter boards
  • Flipchip (C4)
  » Pin in Paste (PiP)
  » Through Hole Reflow (THR)
  » Reworkable underfill, conformal coating
  » Single ball rework
 
 
 
   
 
 
 
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