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  :: Inline True 3D-CT Automated X-ray Inspection System
   
 

Automated X-ray inspection, or AXI, is a technology that uses X-rays to examine the features of a printed circuit board, semiconductor package, or power module that are hidden from view and therefore cannot be captured by automated optical inspection (AOI), which uses visible light as its source.

True 3D X-ray inspection is another Saki first. Most so-called "3D" X-ray systems have really been 2.5D because they work based on deconstruction, where they capture an image and have to remove the images from the underside of the board. Saki's system works based on reconstruction. Saki's very high resolution planar computed tomography (PCT) technology is an extension of CT scanners used in the medical field and was developed in-house by Saki engineers and scientists. The automated inspection process completely separates the top and bottom-side images of the board, so images are not affected by back-side mounting. Saki's PCT technology utilizes a high-resolution image composed from 200 imaging slices acquired through the board, solder joints, and components, whereas other AXI machines only use about five slices for imaging.

     
 

3Xi – M110 : - For Printed Circuit Board Assemblies (PCBAs)

The 3Xi-M110 ensures hidden solder joint quality for bottom-electrode packages such as BGAs, LGAs, and QFNs. PCT provides precise volumetric measurements and shape reconstruction to find voids, head-in pillow (Hip), and other defects that are extremely difficult to identify.

Revolutionary x-ray tube reduces x-ray exposure up to 70% by powering on x-rays only at the moment of image capture.

  Key Features :
 
  • 110kV 30W, Closed X-ray tube system with Flat Panel 14bit 3M Pixel Detector.
  • PCB Size 50(W)×120(L)mm - 360×330mm.
  • PCT provides precise volumetric measurements and shape reconstruction to find voids, head-in-pillow (HiP), and other defects that are extremely difficult to identify.
  • Revolutionary x-ray tube reduces x-ray exposure up to 70% by powering on x-rays only now of image capture.
  • Inspection Capabilities: Chip Type Parts, Diodes, Tantalum Capacitors, Aluminum Electrolytic Capacitors, Module chips, Transistors, Power Transistors, Connectors, QFP, SOP, CSP, QFN, and BGA.
  • Reliable and consistent positioning accuracy and speed.
  • Optimized Planar Computed Tomography (PCT) technology algorithm improves image capture speed by 30%, reducing takt time.
     
 

3Xi – M200: - Insulated Gate Bipolar Transistors (IGBTs)

Saki’s unique “Planar CT Technology” analyzes the internal structures of planar objects. The detector
moves parallel with the planar object capturing images from various directions, thereby enabling quick
and accurate generation of the tomogram of the planar object. This unique parallel movement permits
repeated correction of the reflected images to create a high-resolution image, utilizing less images.

  Key Features :
 
  • Saki’s unique “Planar CT Technology” analyzes the internal structures of planar objects. The detector moves parallel with the planar object capturing images from various directions, thereby enabling quick and accurate generation of the tomogram of the planar object. 
  • 200kV Open X-ray tube System with 1M Pixel Detector.
  • PCB Size - 50(W)×140(L)mm - 360×330mm
  • Inspection Categories: - ・Chip Type Parts, Diodes, Tantalum Capacitors, Aluminum Electrolytic Capacitors, Module chips, Transistors, Power Transistors, Connectors, QFP, SOP, CSP, QFN, and BGA.
  • Double motor-driven system and high-precision linear scale by Magnescale assures precision and power.
  • Saki’s unique powerful 200keV high-precision X-ray imaging and 3D reconstruction penetrate the heat sink’s multiple layers for clearer images.
  • Linking the hardware and software with an automated inspection algorithm optimizes inspection for a clearer, more reliable image with less noise.
 
 
 
 
 
     
     
 
 
 
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