Home  
    Contact Us  
    Enquiry  
    SiteMap  
I CORE BUSINESS I PRODUCTS I CONTACTS I SERVICE I BROCHURE I SOLAR DIVISON
 
 
  :: Saki - 3D Solder Paste Inspection Machine (3D SPI) 3Si Series
 

 

Saki 's unique, state-of the-art 3D measurement technology provides advanced analysis capability, with easy and powerful image-viewing features that allow the user to rotate, enlarge, and reduce images. he system automatically measures warpage at various points across a broad area of the board and optimizes the settings based on the warpage and the printed solder paste thickness to provide the greatest accuracy in warpage measurement and compensation. The process control chart shows real-time data, as well as hourly summaries.

Solder paste inspection combines full color 2D and 3D images and is based on 3D data. 2D imaging is used for fiducial mark recognition, coordinate adjustment, and pad-based warpage compensation, providing a full-color 2D image that verifies the height information for a wide variety of PCB situations, such as flexible printed circuit boards and colored PCBs. 3D imaging is used for highly accurate height measurement. The condition of the solder paste is measured and automatically judged in 3D for each pad. Saki's 3D SPI system ensures high repeatability of inspection results, with height inspection repeatability of 2m at 3s and volume inspection repeatability of +/- 3% with a high gauge repeatability and reproducibility (GR&R).

The system automatically measures warpage at various points across a broad area of the board and optimizes the settings based on the warpage and the printed solder paste thickness to provide the greatest accuracy in warpage measurement and compensation. The process control chart shows real-time data, as well as hourly summaries.

 

Key features of SAKI 3D AOI Series.

  • Rigid gantry structure and dual motor-drive system.
  • Self-diagnostic functions.
  • High resolution linear scale for accurate positioning.
  • CoaXPress camera for faster inspection & measurement process.
  • Simultaneous 2D and 3D inspection of the entire board.
  • Scalable optical resolutions of 7m, 12m, and 18m.
  • Flexible gantry for M/L/XL PCBA sizes and dual lanes.
  • Self-Programming (SSP) Software.
  • Newly developed high-speed mode increases measurement and inspection speed by about 190%.
  • Coplanarity inspection.
  • SPC function.
  • Highly Management System for data logging and history.
  • Golden & Silver Sample Check Function for process verification.
 
 

 

Dimensions L- Single Lane L-Duel Lane XL Single Lane
Model Name 3Si-LS2 3Si-LD2 3Si-ZS2
PCB Size (mm) 7μm camera head Single mode Dual mode 50×60〜686×870,
7μm camera head
50×60〜330×330, 50×60〜 330×330, 50×60〜 320×330,
12/18μm camera head 12/18μm camera head
50×60〜500×510, 50×60〜 500×510, 50×60〜 320×510,
PCB Clearance Top:40mm, 1.57in. Bottom:60mm, 2.36in Top:40mm, 1.57in. Bottom:50mm, 1.96in. Top:40mm, 1.57in. Bottom:60mm, 2.36in
Size (W)X(D)X(H) (mm,in) 1040×1440×1500 1040×1440×1500 1340×1440×1500
Weight  900kg, 1984.16lb  900kg, 1984.16lb  900kg, 1984.16lb
Electric Power  Single Phase〜200-240V+/-10%, 50/60Hz  
Air Requirement  0.5MPa, 5L/min(ANR)  
 
 
 
 
About Us   I  Principals  I  Products   I  News & Updates   I  Services  I  Enquiry   I  Contact Us   I  Our Customer   I  Career   I   Download Brochure   I  Sitemap   I  CC TV Login
 

932, 9th Floor JMD Megapolis, Sohna Road,
Sector - 48 GURGAON 122 018
Copyright 2019 by INETEST.CO.IN. All rights Reserved. Mail : india.sales@inetest.co.in

    Web Presence By CFCS