Finetech Fineplacer ® Coreplus

Finetech is a 23-year-old company founded in Berlin Germany, the complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing can be performed on the same compact rework system

Key Features

  • Flexibility, Full hot air rework system
  • Under-heating system, Large PCBs 480 x 480 mm2
  • Software, Software controlled top heater calibration
  • Performance, In-situ process observation in HD
  • Multifunctionality, Placement accuracy better 10 µm
  • Process control, Full process access & easy visual programming with touch screen interface
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Full process access and easy programming
  • From small 008004 components to massive BGA – with a broad range of supported applications and processes,

Advantages

  • Customer specific tooling
  • 3-color LED illumination
  • Modular machine platform allows in-field retrofitting during entire service life
  • Individual configurations with process module
  • Force controlled component handling

Applications

  • LED rework                                                                      
  • Sub-assemblies
  • Daughter boards
  • RF frames
  • RF shields
  • µBGA/CSP
  • Film capacitor
  • Interposer boards
  • Rework on flex
  • Small passives down to 0402
  • PoP
  • DFN
  • QFN
  • Connectors

Applications Images

Technical Data

AttributeRespective Value
Placement accuracy:25 µm
Field of view (min)1 12.1 mm x 7.6 mm
Field of view (max)1 65 mm x 45 mm
Component size (min)10.25 mm x 0.25 mm
Component size (max)60 mm x 60 mm
Board Size (max)2 400 mm x 310 mm
Board Thickness (max)6 mm
Thermocouples4
Top Heating Power900 W
Gas temperature (max)380°C
Temperature ramp rate1 K/ s – 50 K/ s
Flow Range10 Nl/ min – 70 Nl/ min
Board Heating Power1600 W
Gas Temperature (max)360°C
Flow Range32 Nl/ min – 160 Nl/ min