Martin EXPERT 10.6 RS

Semi-automated rework station with Gantry system for small to very large and massive components. The proven hybrid underheater allows gentle heating of boards with dimensions up to 500 x 500 mm².
For safe handling of all components, the precise positioning system can navigate to any point on the PCB. Pre-positioning is performed via the smooth-running XY gantry, while fine positioning and placement is fully automatic using reliable Martin precision/technology.

Key Features

  • Flexibility, Various PCB sizes and shapes as well as components available.
  • Under-heating system, Large PCBs 500 x 500 mm2
  • Performance, Uniform heat distribution through convection and hybrid technology
  • Multifunctionality, one device for all processes, including desoldering, pad cleaning, automatic positioning, and soldering
  • Process control, Automatic profiler for under- and top-heating systems
  • Software, Simple, intuitive, tablet-compatible

Standard Equipment

  • Tool set for placing, residual solder removal and soldering with magazine
  • Set of placement nozzles XL-type (BGA/CSP) 5 mm, 8 mm, 15 mm with O-Ring
  • Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
  • Two camera lenses (BGA, CSP)
  • Two thermocouple sensors (type K)
  • Four PCB magnet holder 40.5 mm (standard)
  • Two PCB clips to install at hand rest
  • Intuitive software EASYSOLDER 07 with touch integration

Application

  • LED rework                                                                      
  • Sub-assemblies
  • Daughter boards
  • RF frames
  • RF shields
  • µBGA/CSP
  • Film capacitor
  • Interposer boards
  • Rework on flex
  • Small passives down to 0402
  • PoP
  • DFN
  • QFN
  • Connectors

Application Images

Technical Data

Power consumption 5,500 VA
Power solder pen 400 W, 35 l/min
Power under-heating system 1,200 – 5,000 W (6 x IR-lamps)
Size under-heating system 420 x 450 mm²
Max. PCB size 500 x 500 mm²
Resolution Motion System 0.001 mm
± 0.030 mm (CSP)
± 0.040 mm (BGA)
± 0.070 mm (Maxi BGA)*
High resolution CMOS-camera 5 Mio. Pixel,USB2
Size of component Lens X Y
Flip Chip min. 0.2 mmx 0.2mm
max. 15 mm x 12mm
CSP min. 0.5 mm x 0.5 mm
max. 35 mm x 25 mm
BGA min. 1 mm x 1 mm
max. 45 mm x 35 mm
Maxi BGA min. 2 mm x 2 mm
max. 70 mm x 55 mm