Martin Expert 10.6 HV

Uniform heat distribution through convection and hybrid technology Automated SMD placement process by Auto Vision Place

Key Features

  • Flexibility, Various PCB sizes and shapes as well as components available up to 65 x 85 mm²
  • Under-heating system, Large PCBs 275 x 245 mm² mm2
  • Performance, Uniform heat distribution through convection and hybrid technology
  • Multifunctionality, one device for all processes, including desoldering, pad cleaning, automatic positioning, and soldering
  • Process control, Automatic profiler for under- and top-heating systems
  • Software, Simple, intuitive, tablet-compatible

 

Advantages

  • Hybrid rework station with 3000W,
  • The IR BGA rework station operates silently
  • DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K).
  • This system is particularly suitable for large size PCBs like PCs, Laptops and Server Boards with small up to very big components.

Application

  • LED rework                                                                      
  • Sub-assemblies
  • Daughter boards
  • RF frames
  • RF shields
  • µBGA/CSP
  • Interposer boards
  • Rework on flex
  • Small passives down to 0402
  • PoP
  • DFN
  • QFN
  • Connectors

Application Images

Technical Data

Power consumption3,500 VA
Power solder pen300 W, 35 l/min
Power under-heating system600-3,000 W( 6 x IR-lamps)
Size under-heating system275 x 245 mm²
Max. PCB size305 x 305 mm²
Resolution motion system0,001 mm
Placement accuracy± 0,015 mm(Flip Chip)*
± 0,030 mm(CSP)
± 0,040 mm(BGA)
± 0,070 mm(Maxi BGA)*
High resolution CMOS-camera5 Mio. Pixel,USB2
Size of componentLensXY
Flip Chipmin.0.2 mmx 0.2mm
max.15 mm x 12mm
CSPmin.0.5 mm x 0.5 mm
max.35 mm x 25 mm
BGAmin.1 mm x 1 mm
max.45 mm x 35 mm
Maxi BGAmin.2 mm x 2 mm
max.70 mm x 55 mm