Martin Expert 10.6 IV

Uniform heat distribution through convection and hybrid technology Automated SMD placement process by Auto Vision Place

Key Features

  • Flexibility, Various PCB sizes and shapes as well as components available 
  • Under-heating system, Large PCBs 100 x 80 mm2
  • Performance, Uniform heat distribution through convection and hybrid technology
  • Multifunctionality, one device for all processes, including desoldering, pad cleaning, automatic positioning, and soldering
  • Process control, Automatic profiler for under- and top-heating system
  • Software, Simple, intuitive, tablet-compatible

Advantages

  • Hybrid rework station with 1000W,
  • The IR BGA rework station operates silently
  • Automated SMD placement process by Auto Vision Placer
  • DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K).
  • This system is particularly suitable for large size PCBs like PCs, Laptops and Server Boards with small up to very big components.

Application

  • LED rework 
  • Sub-assemblies
  • Daughter boards
  • RF frames
  • RF shields
  • µBGA/CSP
  • Film capacitor
  • Interposer boards
  • Rework on flex
  • Small passives down to 0402
  • PoP
  • DFN
  • QFN
  • Connectors

Application Images

Technical Data

System power consumption 1000VA
Power solder pen 300 W, 35 l/min
Power under heater 110 W, 2 x IR lamps
Effective heating area 80 x 60 mm²
Recommended max. PCB size 100 x 80 mm²
Resolution motion system 0,001 mm 
Placement accuracy ± 0,015 mm (Flip Chip)
± 0,030 mm (CSP)
± 0,040 mm (BGA)
High resolution CMOS-camera 5 Mio. Pixel, USB2