MARTIN HOTBEAM 05
Uniform heat distribution through convection and hybrid technology
Key features
- Format: in terms of the circuit board’s shape and size; up to 200 x 250 mm can be processed
- Flexibility, preheating circuit board for the subsequent Rework process, through to curing and cracking of underfill
- Performance: HOTBEAM and SMART DESOLDER combination for the perfect Rework
- The high performing under heater in IR technology
Advantages
- This device is perfectly suitable for hand soldering tasks on mid-size and heavy PCBs,
- The innovative heating-management system ensures a reproducible circuit board temperature without overshooting at the highest long-term stability.
- the IR lamps, which are protected by a glass plate, are independently switchable. This makes cleaning of the hot area easy and simple
Application
- BGA
- QFN
Application Images
Technical Data
| Power Consumption | 2,100 VA |
| Power underheating system | 2,000 W |
| Size underheating system | 185 x 245 mm2 |
| Max. PCB size | 200 x 260 mm2 |
| Temperature range | 50 °C – 250 °C |
| Mains | 1 Phase, 85 – 250 VAC, 50 – 60 Hz |
| Cooling | Electrically, 4 x fans |
| Dimensions | 450 x 370 x 70 mm3 |