Martin Master IXH

Uniform heat distribution through convection and hybrid technology 

Key Features

  • Flexibility, Various PCB sizes and shapes as well as components available up to 75 x 75 mm2
  • Under-heating system, PCBs 200 x 260mm²
  • Performance, Uniform heat distribution through convection and hybrid technology
  • Multifunctionality, one device for all processes, including desoldering, pad cleaning, and soldering
  • Process control, Automatic profiler for under- and top-heating systems

 

Advantages

  • Hybrid rework station with 2500 VA,
  • The IR BGA rework station operates silently
  • DBL 06 control unit with Two high resolution sensors inputs for thermocouples (Type K).

Application

  • LED rework                                                                      
  • Sub-assemblies
  • Daughter boards
  • RF frames
  • RF shields
  • µBGA/CSP
  • Film capacitor
  • Interposer boards
  • Rework on flex
  • Small passives down to 0402
  • PoP
  • DFN
  • QFN
  • Connectors

Application Images

Technical Data

Power Consumption:  2500VA
Power Solder Pen:  300 W, 35 l/min 
Power Underheater:  500-2000 W, 4 x IR-lamps 
Effective heating area:  185 x 245mm² 
Recommended max. PCB size:  200 x 260mm² 
Temperature Sensor Input:  2 pcs. Type K 
Mains:  1Phase, 230VAC, fused 16A 
Pressurized air:  Vacuum:  5-8 bar (0,6psi), Dry, Clean (40µ filtered) air consumption: 100 l/min 
Not required (generated by compressed air) 
  5 Mio. Pixel, USB2