Martin Mini Oven
Uniform heat distribution through convection and hybrid technology
Key Features
- Tools: Wide range of tooling and accessories for BGA re-balling
- Software: The free of charge PC software EASYBEAM V2 can be used to download profiles,
- Storage, 25 Reballing profiles which can be saved in the device
- Program Teaching, Profiles can be taught with the devices auto profiler software
Advantages
- The large display and the 4-button front panel layout enable fast set-up and administration,
- Its highly efficient hybrid heating technology heats-up the electronic components like in a standard reflow oven:
- MINIOVEN 05 is perfect for use in both production and R&D environment.
Application
- BGA
- QFN
Application Images
Technical Data
| System power consumption | 550 VA |
| Power heater | 500 W, 4 x IR-Lamps |
| Size heater | 105 x 130 mm² |
| Number of Temperature Sensors | 1 x internally inst. & 1 x external opt. |
| Number of profiles | 25 entries on device |
| Rec. max. component Size | 55 x 55 x 4 mm³ |
| Mains | 1 Phase, 230 VAC |
| System dimensions | 150 x 300 x 85 mm³ |