H3580

SPEA H3580 is a pick&place test handler, designed to perform the high-throughput handling of IC components (packaged, or in strip/wafer frame) during the final test phase. Its modular design is open to compose a variety of input / output media configurations, to best fit with any process flow, with the possibility to modify the configuration also at the customer’s site, by retrofitting different input / output modules. Mechanical architecture is based on full linear motion technology, which features controlled axis acceleration and speed, to guarantee fast and accurate handling. Motion profiles and contacting mechanisms minimize the force applied to the devices: This makes H3580 able to handle MEMS devices with no risk to cause extra shock to their internal micromechanical structures.

Main features

  • High throughput: up to 33,000 UPH
  • 50x parallel handling, 392x parallel testing
  • Input from tray, wafer/strip frame, tape, or bowl feeder
  • Output on tray, wafer/strip frame, tape or box
  • Nitrogenless temperature conditioning
  • Multiple, reconfigurable test units for MEMS, ICs, KGD devices
  • Vision units (top, bottom, 5S) for traceability, package integrity test, jam prevention
  • Minimum device size: 1x1x0.5mm
  • Device packages: KGD, QFP, LGA, QFN, BGA, SOXXX, SOxxx, SOTxxx, PGA, TQFP, CSP, others